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Off-line assembly systems

DDM NOVASTAR LE40V SMD pick & place system

Manufacturer

DDM Novastar

Subtotal Price

Available upon request

Catalogue code

AP-LE40V

  • Benchtop pick & place machine
  • Cognex vision centering
  • Max. PCB dimensions 343 x 560 mm
  • Vision system equipped with two cameras: bottom and top with a resolution of up to 10µm
  • Placing of components: chip 0201 to 1206, melf, LED, SOIC, SOT, PLCC, fine pitch QFP, BGA and others
  • Compensatory correction
  • The maximum size of placed components 35 x 35 mm
  • 64 slots for 8mm feeders (96 with optional Bank Feeder)
  • Placement speed up to 3000 cph
  • Centering components on - the - fly with an accuracy of 0.0254 mm
  • Four (optionally eight) vacuum grippers with automatic change and recognition
  • Component lighting: 4 zones
  • Friendly, "learning" software running on the Windows environment
  • Possibility of applying glue or solder paste (option)
  • ADVANTAGES
  • Multiboard panels support (automatic program duplication)
  • Reference point recognition with automatic position correction
  • Easy to program, change and use
  • The possibility of correcting the program during work
  • Virtually unlimited ability to remember created programs
  • Error indication with automatic cycle stop
  • Safety of use
  • Low purchase and operating costs
  • Easy to adapt to the individual needs of the user
  • Rich optional equipment, increasing production possibilities and comfort of work
  • STANDARD EQUIPMENT
  • Pick & Place machine
  • A computer with a monitor
  • Software - a device control program
  • Four - position automatic nozzle changer
  • Accurate positioning station
  • Gripper head
  • Four standard nozzles
  • CCD color camera
  • Compressor
  • Board clamps
  • Optical scale with digital encoder
Weight
250 kg
Product Code
AP-LE40V
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Description
  • Benchtop pick & place machine
  • Cognex vision centering
  • Max. PCB dimensions 343 x 560 mm
  • Vision system equipped with two cameras: bottom and top with a resolution of up to 10µm
  • Placing of components: chip 0201 to 1206, melf, LED, SOIC, SOT, PLCC, fine pitch QFP, BGA and others
  • Compensatory correction
  • The maximum size of placed components 35 x 35 mm
  • 64 slots for 8mm feeders (96 with optional Bank Feeder)
  • Placement speed up to 3000 cph
  • Centering components on - the - fly with an accuracy of 0.0254 mm
  • Four (optionally eight) vacuum grippers with automatic change and recognition
  • Component lighting: 4 zones
  • Friendly, "learning" software running on the Windows environment
  • Possibility of applying glue or solder paste (option)
  • ADVANTAGES
  • Multiboard panels support (automatic program duplication)
  • Reference point recognition with automatic position correction
  • Easy to program, change and use
  • The possibility of correcting the program during work
  • Virtually unlimited ability to remember created programs
  • Error indication with automatic cycle stop
  • Safety of use
  • Low purchase and operating costs
  • Easy to adapt to the individual needs of the user
  • Rich optional equipment, increasing production possibilities and comfort of work
  • STANDARD EQUIPMENT
  • Pick & Place machine
  • A computer with a monitor
  • Software - a device control program
  • Four - position automatic nozzle changer
  • Accurate positioning station
  • Gripper head
  • Four standard nozzles
  • CCD color camera
  • Compressor
  • Board clamps
  • Optical scale with digital encoder
Technical details
Weight
250 kg
Product Code
AP-LE40V
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