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Den-On RD-500SV BGA rework system

Catalog no.: DL-RD-500SV

Den-On RD-500SV BGA rework system
Den-On RD-500SV BGA rework system

Den-On RD-500SV BGA rework system

Catalog no.: DL-RD-500SV

Price available
upon request

Manufacturer: Den-On

Delivery 14 - 21 days
  • Description
  • Ask for product
  • Responsible
    person
  • General information

    • Maximum PCB size: 400 x 420 mm
    • Minimum component size: 01005
    • Three heaters: upper: 1000 W convection, lower: 1000 W convection, horizontal: 500W x 4IR 2000W infrared heaters
    • Excellent positioning precision: ± 0.015 mm
    • Highest quality optics
    • Protection to prevent PCB deformation and overheating of the component
    • Efficient and advanced software
    • Solder paste application kit included
    • Excellent process repeatability
    • Two - point cooling system

    ADVANTAGES

    • Profile creation using pin temperature measurement (e.g. solder balls) and the upper surface of the component
    • Accurate temperature measurement with five thermocouples and computer analysis prevent component overheating and ensure selection of the most effective process parameters
    • Advanced optical system, controlled by software from a PC, guarantees precise positioning of the component
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    General information

    • Maximum PCB size: 400 x 420 mm
    • Minimum component size: 01005
    • Three heaters: upper: 1000 W convection, lower: 1000 W convection, horizontal: 500W x 4IR 2000W infrared heaters
    • Excellent positioning precision: ± 0.015 mm
    • Highest quality optics
    • Protection to prevent PCB deformation and overheating of the component
    • Efficient and advanced software
    • Solder paste application kit included
    • Excellent process repeatability
    • Two - point cooling system

    ADVANTAGES

    • Profile creation using pin temperature measurement (e.g. solder balls) and the upper surface of the component
    • Accurate temperature measurement with five thermocouples and computer analysis prevent component overheating and ensure selection of the most effective process parameters
    • Advanced optical system, controlled by software from a PC, guarantees precise positioning of the component
    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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