General information

• Improved design of flow heating elements, with the rotor enlarged by 40%, ensures uniform temperature distribution (lowest Delta Ts) even on the most demanding boards. Additionally, the Uniform Gas Management System eliminates nitrogen flow losses and reduces nitrogen consumption by up to 40%.
• The new, air cooling module guarantees a cooling intensity of >3°C/sec, even for the LGA - 775 CPU holders. The cooling rate meets even the most stringent requirements of lead - free profiles
• The new efficient cooling pipe system captures flux vapour in condensation containers, which can be easily replaced during furnace operation, significantly reducing maintenance downtime. In addition, Heller's proprietary Flux - Free Grill System™ technology not only reduces flux residue on the cooling grilles, eliminating the need for regular maintenance, but also has a positive impact on process efficiency.
• Using ECD solutions, the innovative software package offers three - level process control by monitoring oven capacity, process and product traceability. Available software guarantees optimization of all parameters and easy and quick access to statistical quality control (SPC ) reports.
• The solution developed in cooperation with KIC offers the possibility to immediately obtain temperature profile parameters after entering basic data such as length, width and weight of the package into the system. The optimal profile will be selected from the extensive library of profiles and solder pastes with a dynamic structure.
• Heller's patented software solution enables you to adjust the exhaust/ventilation power to the current state of the production process, optimising energy consumption
• The length of the heating tunnel: 430 cm
• Number of heating zones: 13 (top / bottom)
• Number of cooling zones: 3
• Temperature range: 65 - 350°C
• Temperature stabilization: ±1°C
• Edge - hold transport system
• Transport speed: 188 cm/min. max.