General information

• Halogen - free solder paste, tested according to EN14582 standard
• Low air bubble content in solder for BGA, CSP, QFN components
• High stability of parameters in the production environment
• High oxidation resistance
• Excellent for moistening oxidized BGA and pad surfaces
• Excellent soldering performance in high temperature and long reflow processes
• Clear flux residue for testing
• Compatible with other SnPb alloys
• Store at temperatures below 10°C
• Lifespan: 12 months
• No - clean (residues do not cause corrosion)
• Classification: ROL0
• Grain size: type 4,5
• Package: 500 g plastic jar