General information

• Halogen - free, Pb - free solder paste
• Low cost and high efficiency printing especially in the production of electronics packages for cell phones and other electronic devices
• Unmatched print performance while maintaining high quality on the smallest deposits (8 mil), resulting in reduced print error rates and high throughput and efficiency
• Low print pressure and excellent response to production stops, saving time and money on stencils and product changes
• Allows frequent "dry" stencil cleaning without solvents, reducing costs
• Increased bandwidth
• Higher print speed and reduced cleaning frequency for short work cycles and high print throughput
• Store at temperatures below 10°C
• Lifespan: 12 months
• No - clean (residues do not cause corrosion)
• Classification: ROL0
• Grain size: type 3
• Package: 500 g plastic jar