PIERGIACOMI DPF-300 EVO depanelling machine – manual PCB depanelization system with milling cutter
The PIERGIACOMI DPF-300 EVO depanelling machine is a device created for manual depaneling of small and medium PCB series, in situations where the use of pliers would generate excessive stress on the laminate fibers and a full automatic system would be economically unjustified. The construction is based on an interchangeable guide made of hardened and tempered steel and milling cutters made of carbide designed for cutting FR4, CEM and aluminum laminates (standard diameters 0.8–3.175 mm). A stable worktable with ESD EPB 90° laminate and steel, galvanized components ensures resistance to load and repeatability of operation.
Ergonomics of use and quick tool change function
The DPF-300 EVO is equipped with a patented guide that enables quick replacement of both the guide itself and the cutter, which significantly shortens the station preparation time. The special geometry of the guide allows the operator to safely insert the board and then pull it until the bridges connecting the panel elements are fully cut. The height of the worktable can be adjusted at three levels: 900, 1000 and 1100 mm, which improves ergonomics of work and enables easy adaptation of the device to various production stations.
Precision of cutting and maximum protection of components
The system enables the separation of PCBs with quality comparable to automatic solutions, without the risk of stress, cracks or delamination of the laminate. According to the manufacturer's data, the maximum board thickness is 4 mm, the minimum slot length – 11 mm, and the width of the milled slot corresponds to the thickness of the standard guide (0.8–3.175 mm, tolerance 0/–0.02 mm). The DPF-300 EVO allows work with components up to 23 mm high (7 mm from the cutter axis) or 20 mm (4 mm from the cutter axis), as confirmed by illustrations and technical data on the document page.
Extraction system and technical parameters of the device
The integrated extraction system with a cartridge filter (1"-1/4), placed directly at the guide, enables work without excessive dust; optionally a HEPA H14 filter is available. The microspindle reaches up to 24,000 rpm, and the device operates at a noise level of approx. 80 dB(A), with vibrations below 2.5 m/s². The DPF-300 EVO requires a working space of 164 × 170 cm and weighs 68 kg. Power supply: 230 V / 50 Hz, power 1.1 kW, 230 V 2P+T Schuko socket, with depression of the extraction system about 25 kPa (–250 mbar).
Key parameters of the DPF300 EVO depaneling system:
- type: manual PCB depanelization system (milling),
- PCB thickness: max. 4 mm,
- slot length: min. 11 mm,
- slot width: 0.8–3.175 mm (tolerance 0 / –0.02 mm),
- component height: 23 mm (7 mm from the cutter) / 20 mm (4 mm from the cutter),
- guide: interchangeable, hardened and tempered steel,
- milling cutters: carbide, diameters 0.8–3.175 mm,
- spindle speed: up to 24,000 rpm,
- filtration: cartridge filter, optional HEPA H14,
- worktable: ESD EPB 90° laminate,
- working height: 900 / 1000 / 1100 mm,
- vibrations: < 2.5 m/s²,
- noise level: approx. 80 dB(A),
- required working area: 164 × 170 cm,
- device dimensions: 64 × 70 × 95 cm,
- weight: 68 kg,
- power supply: 230 V 50 Hz,
- power: 1.1 kW,
- socket: 230 V 2P+T Schuko,
- depression of extraction system: 25 kPa (–250 mbar),
- options: side shelves, table height control with memory, transport handles, HEPA H14 filter.
Professional tool for precise PCB depaneling
The PIERGIACOMI DPF-300 EVO depanelling machine is a solution aimed at production environments where repeatability of cutting quality, safety for components and the ability to work with panels of various geometry are essential. Thanks to the patented guide, easy table height adjustment and integrated extraction system, the device offers efficiency comparable to automatic systems, at much lower implementation costs. It is a refined tool that ensures accuracy, ergonomics and process cleanliness in every production series.
