Quadra DVC EVO SMD auto pick & place system – performance and precision in one solution

The Quadra DVC EVO SMD auto pick & place system is a professional-grade industrial machine designed to meet the demands of companies seeking high reliability, precision, and flexible configuration in SMD assembly. Developed by Italian manufacturer TWS Automation, the Quadra DVC EVO combines advanced technology with a compact design, delivering fast placement speeds, extensive customization capabilities, and compatibility with a broad range of components.

Equipped with two nozzles on a single placement head and a high-precision positioning system offering 0.01 mm resolution on the X/Y axes, the system enables precise placement of even the smallest components – from 0201 packages to MELF, diodes, trimmers, and BGAs up to 50 × 50 mm. With a placement rate of up to 4,400 components per hour (CPH) and the capacity to support up to 120 tape feeders (8 mm) distributed across 15 BankFeeder modules, the Quadra DVC EVO is ideal for small- and medium-scale production environments.

Versatility and quality control

A built-in vision system with bottom camera ensures real-time verification of component position and orientation, minimizing placement errors and reducing production waste. The machine also offers optional integration of a solder paste dispenser, enabling a fully automated SMT workflow in a single compact system.

The standard working area of 440 × 360 mm (extendable to 550 × 420 mm) allows the system to handle large PCBs and supports parallel processing of multiple production zones. It is compatible with a wide variety of components, from miniature chips and electrolytic capacitors to fine-pitch ICs.

Key technical features – Quadra DVC EVO

Dual-nozzle system on a single placement head.

Placement speed: up to 4,400 CPH.

Feeder capacity: up to 120 × 8 mm tape feeders (15 BankFeeder modules).

Component range: 0201 to 50 × 50 mm (supports BGA, MELF, trimmers, inductors, diodes, SOT, ICs).

Optional solder paste dispenser for complete SMT automation.

Working area: 440 × 360 mm (extendable to 550 × 420 mm).

Positioning resolution: 0.01 mm on X/Y axes.

High-precision vision system for real-time component alignment and verification.

Invest in precision and scalable production

The Quadra DVC EVO is the ideal choice for manufacturers prioritizing quality, efficiency, and modern production strategies. Its modular configuration, broad component support, and automation readiness make it a perfect fit for both high-throughput production lines and specialized engineering labs.

Choose a system that enhances your production capabilities and positions your business for competitive growth.

Product information:

2 nozzles on one head mm

Capacity up to 4400 CPH

Maximum 120 feeders 8mm

15 BankFeeder

8 feeders each

Maximum stacking size: from 0201 to 50x50mm (BGA)

Soldering paste dispenser - option

Work area: 440 x 360 mm (550 x 420 mm - optional)

Resolution: for X / Y axis: - 0,01APPLICATION- TWS Automation devices, thanks to their individual configuration, high precision and reliability, open new areas of operation in small and medium-volume production.

Supported components: CHIP from 0201, MELF and MINI MELF, diodes, SOT, integrated circuits up to 40mm, trimmers, inductors and aluminum electrolytic capacitors
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- Name:
  
  Dział sprzedaży
- E-mail:
  
  sklep@renex.pl
- Address:
  
  Al. Kazimierza Wielkiego 6E
- Postal code:
  
  87-800
- City:
  
  Włocławek
- Country:
  
  Poland

Description

Quadra DVC EVO SMD auto pick & place system – performance and precision in one solution

The Quadra DVC EVO SMD auto pick & place system is a professional-grade industrial machine designed to meet the demands of companies seeking high reliability, precision, and flexible configuration in SMD assembly. Developed by Italian manufacturer TWS Automation, the Quadra DVC EVO combines advanced technology with a compact design, delivering fast placement speeds, extensive customization capabilities, and compatibility with a broad range of components.

Equipped with two nozzles on a single placement head and a high-precision positioning system offering 0.01 mm resolution on the X/Y axes, the system enables precise placement of even the smallest components – from 0201 packages to MELF, diodes, trimmers, and BGAs up to 50 × 50 mm. With a placement rate of up to 4,400 components per hour (CPH) and the capacity to support up to 120 tape feeders (8 mm) distributed across 15 BankFeeder modules, the Quadra DVC EVO is ideal for small- and medium-scale production environments.

Versatility and quality control

A built-in vision system with bottom camera ensures real-time verification of component position and orientation, minimizing placement errors and reducing production waste. The machine also offers optional integration of a solder paste dispenser, enabling a fully automated SMT workflow in a single compact system.

The standard working area of 440 × 360 mm (extendable to 550 × 420 mm) allows the system to handle large PCBs and supports parallel processing of multiple production zones. It is compatible with a wide variety of components, from miniature chips and electrolytic capacitors to fine-pitch ICs.

Key technical features – Quadra DVC EVO

Dual-nozzle system on a single placement head.
Placement speed: up to 4,400 CPH.
Feeder capacity: up to 120 × 8 mm tape feeders (15 BankFeeder modules).
Component range: 0201 to 50 × 50 mm (supports BGA, MELF, trimmers, inductors, diodes, SOT, ICs).
Optional solder paste dispenser for complete SMT automation.
Working area: 440 × 360 mm (extendable to 550 × 420 mm).
Positioning resolution: 0.01 mm on X/Y axes.
High-precision vision system for real-time component alignment and verification.

Invest in precision and scalable production

The Quadra DVC EVO is the ideal choice for manufacturers prioritizing quality, efficiency, and modern production strategies. Its modular configuration, broad component support, and automation readiness make it a perfect fit for both high-throughput production lines and specialized engineering labs.

Choose a system that enhances your production capabilities and positions your business for competitive growth.

Product information:

2 nozzles on one head mm
Capacity up to 4400 CPH
Maximum 120 feeders 8mm
15 BankFeeder
8 feeders each
Maximum stacking size: from 0201 to 50x50mm (BGA)
Soldering paste dispenser - option
Work area: 440 x 360 mm (550 x 420 mm - optional)
Resolution: for X / Y axis: - 0,01APPLICATION- TWS Automation devices, thanks to their individual configuration, high precision and reliability, open new areas of operation in small and medium-volume production.
Supported components: CHIP from 0201, MELF and MINI MELF, diodes, SOT, integrated circuits up to 40mm, trimmers, inductors and aluminum electrolytic capacitors