General information

• Contact - free assembly/disassembly (hot air)
• Easy handling
• Compact design (integrated compressor)
• Silent compressor for low - noise operation
• Vacuum gripper as standard for safe component lifting
• Acoustic system to indicate reduced hot air flow (optional extra)
• Expandable to a professional SMT repair station (compatibility with heater, stand, etc.) - The ST 300 is an analog, self - contained system for the manual installation and removal of SMD’s. - The unit offers a non - contact heating method for the manual installation and removal of virtually any standard surface mount component including BGAs, QFNs, SOICs and many other SMDs.
• The system uses a pump to generate airflow that first passes through a heater, where it is warmed to the appropriate temperature, and then through a nozzle that “shapes” the air stream for the specific component.