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Vapor Phase Two galden vapor soldering oven
Catalog no.: VP-TWO- New Product
Vapor Phase Two galden vapor soldering oven
Catalog no.: VP-TWOPrice available
upon request
Producent:
Shipping time to be agreed
- Description
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-
General information
- The Vapor Phase Two offers one of the most gentle soldering processes for prototyping or small sized batch production. In contrast to infrared or convection processes, assemblies with high thermal mass, fine pitch structures or temperature - sensitive components can be processed without any problems.
ADVANTAGES
- Fast temperature profiles - The design of Vapor Phase Two allows the user to run fast temperature profiles using a height - adjustable PCB lift.
- Custom soldering profiles - The Vapor Phase Two can import individual soldering profiles via an SD card. Based on these profiles, heating power and lift position are adapted to different solder pastes and PCB technologies.
- Quick Cool - This feature shortens the process time and ensures minimal loss of Galden when the board is removed.
- Anti Condensation - With the vapor phase technology, the soldered assembly is generally covered with Galden residues. Our assembly is kept at a temperature of 120 °C after the soldering process, thus leaving hardly any residues.
- Lifting lid - The lid to the process chamber lifts automatically to simplify the insertion and removal of PCBs. This also helps to preserve the heat transfer medium.
- Viewing window - In addition to a screen that displays real - time temperature data, the Vapor Phase One features a viewing window with internal lighting that allows you to see into the process chamber.
- Safety - The Vapor Phase Two has a variety of safety mechanisms implemented in both software and hardware to ensure a secure usage and soldering process.
SPECIFICATION
- Dimensions: 627 x 650 x 407 mm
- Maximum soldering area: 300 x 335 mm; Height: 60mm
- Power consumption: max. 2200 W
- Voltage: 115 / 230 VAC (60 / 50 Hz)
- Ambient temperature: +15C ... +35C
- Weight: 35 kg
- Enclosure: Stainless steel
- Cooling: Closed water cooling system with 6x 120 mm fans
- Tested heat - transfer media:Galden LS 230, XS 235, and HS 240
- Volume of Galden: 2kg
- Data interface: SD card
- Display: 4 - inch capacitive touchscreen with 800 x 480 pixels
-
- The Vapor Phase Two offers one of the most gentle soldering processes for prototyping or small sized batch production. In contrast to infrared or convection processes, assemblies with high thermal mass, fine pitch structures or temperature - sensitive components can be processed without any problems.
- Fast temperature profiles - The design of Vapor Phase Two allows the user to run fast temperature profiles using a height - adjustable PCB lift.
- Custom soldering profiles - The Vapor Phase Two can import individual soldering profiles via an SD card. Based on these profiles, heating power and lift position are adapted to different solder pastes and PCB technologies.
- Quick Cool - This feature shortens the process time and ensures minimal loss of Galden when the board is removed.
- Anti Condensation - With the vapor phase technology, the soldered assembly is generally covered with Galden residues. Our assembly is kept at a temperature of 120 °C after the soldering process, thus leaving hardly any residues.
- Lifting lid - The lid to the process chamber lifts automatically to simplify the insertion and removal of PCBs. This also helps to preserve the heat transfer medium.
- Viewing window - In addition to a screen that displays real - time temperature data, the Vapor Phase One features a viewing window with internal lighting that allows you to see into the process chamber.
- Safety - The Vapor Phase Two has a variety of safety mechanisms implemented in both software and hardware to ensure a secure usage and soldering process.
- Dimensions: 627 x 650 x 407 mm
- Maximum soldering area: 300 x 335 mm; Height: 60mm
- Power consumption: max. 2200 W
- Voltage: 115 / 230 VAC (60 / 50 Hz)
- Ambient temperature: +15C ... +35C
- Weight: 35 kg
- Enclosure: Stainless steel
- Cooling: Closed water cooling system with 6x 120 mm fans
- Tested heat - transfer media:Galden LS 230, XS 235, and HS 240
- Volume of Galden: 2kg
- Data interface: SD card
- Display: 4 - inch capacitive touchscreen with 800 x 480 pixels
Description
General information
ADVANTAGES
SPECIFICATION
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