YAMAHA I-Pulse S10 SMD assembly system – precision, efficiency, and reliability in one premium machine
The YAMAHA I-Pulse S10 is a high-end pick & place system engineered for fast and highly precise SMD assembly on PCB boards. It combines cutting-edge technology with a robust industrial design, making it the ideal choice for manufacturers seeking maximum productivity and flexibility. Perfectly suited for both high-volume production and prototyping, the S10 offers the dependability trusted by leaders in the electronics industry.
Equipped with a modern multi-head placement system, the I-Pulse S10 achieves speeds of up to 37,500 CPH while maintaining a placement accuracy of ±0.04 mm. It supports a wide component range – from tiny 01005 (0.4 × 0.2 mm) chips to larger custom packages – making it suitable for assembling everything from compact consumer electronics to complex industrial systems.
Its advanced multi-camera optical recognition system and real-time inspection capability ensure consistent monitoring of placement quality. The intuitive graphical software interface simplifies setup, reduces training time, and allows for quick adaptation to changing projects or production runs.
Key advantages of the YAMAHA I-Pulse S10:
- high placement precision – ±0.04 mm accuracy at up to 37,500 CPH,
- advanced vision inspection – continuous quality control via multiple high-res cameras,
- broad component compatibility – from 01005 to large custom parts,
- flexible working area – supports PCB sizes up to 680 mm (or up to 1200 mm with optional extension),
- multi-head configuration – 10 placement heads in dual-lane or single-lane setups,
- quick changeovers – intuitive UI and automatic calibration,
- industrial-grade construction – built for 24/7 operation with high durability.
Choose performance and versatility with the YAMAHA I-Pulse S10. Boost placement accuracy, reduce assembly errors, and shorten production cycles with a system built to keep pace with the demands of modern electronics manufacturing.
Product information:
- High performance and modular design
- Meets the requirements of a wide range of production processes
- 3D - assembly of components on an irregularly shaped surface
- Modern transport system ensuring support for large PCBs
- Maximum PCB size: 1330 x 510 mm
- Capacity: 45,000 cph
- Supported components: 0201 – 120 x 90 mm
- Transport direction: left to right
- Device locking system after opening the cover
- PCB dimensions: 50 x 30 mm - max. 1330 x 510 mm
- PCB thickness: 0.4 - 5.0 mm
- PCB transport speed: max. 900 mm / sec
- Component height: Max 35 mm