Improved design of flow heating elements, with a rotor increased by 40%, ensures even temperature distribution (lowest Delta Ts) even on the most demanding boards. In addition, the Uniform Gas Management System eliminates losses of nitrogen flow and reduces its consumption by up to 40%
A new, ventilated cooling module guarantees a cooling intensity of > 3°C / sec, even for LGA - 775 processors. The pace of the cooling process meets even the most stringent requirements of lead - free profiles
A new, effective cooling pipe system captures flux vapors in condensation containers that can be easily replaced while the oven is running, significantly reducing downtime due to maintenance work. In addition, Flux - Free Grill System™ technology, proprietary to Heller, not only reduces flux residues on cooling trusses, eliminating the need for regular maintenance, but positively affects the efficiency of the production process
Using ECD's solutions, the innovative software package provides three levels process control by monitoring oven capacity, process capability and product traceability. Available software guarantees optimization of all parameters and easy and quick access to statistical quality control (SPC) reports
The solution developed in cooperation with KIC offers the possibility of immediately obtaining temperature profile parameters after entering basic data such as the length, width and weight of the PCB into the system. The optimal profile will be selected from the database of an extensive library of profiles and dynamic structure soldering pastes
The software solution patented by Heller enables the selection of the right extraction / ventilation power to the current states of the production process, optimizing the level of energy consumption
Heating tunnel length: 182 cm
Number of heating zones: 7 (up / down)
Number of cooling zones: 1
Temperature range: 60 - 350°C
Temperature stabilization: ± 1°C
Edge - hold transport system
Transport speed: 188 cm / min. max.
Name:
Dział sprzedaży
E-mail:
sklep@renex.pl
Address:
Al. Kazimierza Wielkiego 6E
Postal code:
87-800
City:
Włocławek
Country:
Poland
Description
General information
Improved design of flow heating elements, with a rotor increased by 40%, ensures even temperature distribution (lowest Delta Ts) even on the most demanding boards. In addition, the Uniform Gas Management System eliminates losses of nitrogen flow and reduces its consumption by up to 40%
A new, ventilated cooling module guarantees a cooling intensity of > 3°C / sec, even for LGA - 775 processors. The pace of the cooling process meets even the most stringent requirements of lead - free profiles
A new, effective cooling pipe system captures flux vapors in condensation containers that can be easily replaced while the oven is running, significantly reducing downtime due to maintenance work. In addition, Flux - Free Grill System™ technology, proprietary to Heller, not only reduces flux residues on cooling trusses, eliminating the need for regular maintenance, but positively affects the efficiency of the production process
Using ECD's solutions, the innovative software package provides three levels process control by monitoring oven capacity, process capability and product traceability. Available software guarantees optimization of all parameters and easy and quick access to statistical quality control (SPC) reports
The solution developed in cooperation with KIC offers the possibility of immediately obtaining temperature profile parameters after entering basic data such as the length, width and weight of the PCB into the system. The optimal profile will be selected from the database of an extensive library of profiles and dynamic structure soldering pastes
The software solution patented by Heller enables the selection of the right extraction / ventilation power to the current states of the production process, optimizing the level of energy consumption
