The Heller MK7 reflow oven is a pioneering reflow system with several breakthrough designs that meets all customer requirements for lower Delta T on the PCB, reduced nitrogen consumption and product setup time, in a new low - profile enclosure that facilitates visibility across the production floor. The MK7 series is highly configurable, operating with an air chamber as standard, and with nitrogen and vacuum chamber options.
HEATING SYSTEM: An improved low - profile, large - rotor heating module provides the lowest delta T in the product, as well as improved airflow and temperature uniformity
COOLING SYSTEM: Various types of modules and systems are available to suit applications, including the most demanding lead - free profiles. A special cooling option is available for heavy - duty applications that can provide cooling rates >6°C/s and output temperatures below 50°C.
TRANSPORT MODULE: High parallelism and low vibration. Single - lane and dual - lane configurations available, with center board support or mesh belt options.
FLUX MANAGEMENT SYSTEM OPTION: A revolutionary, eco - friendly flux management system using a catalyst that produces no by - products and allows flux to be removed during reflow soldering furnace operation, eliminating the risk of flux blockage.
PROCESS MONITORING SYSTEM OPTION: Developed in collaboration with KIC, the solution offers the ability to instantly obtain temperature profile parameters once basic data such as package length, width and weight are entered into the system. The optimal profile will be selected from the database of an extensive library of profiles and solder pastes with a dynamic structure
SPECIFICATION
Oven length: 360 cm
Heating tunnel length: 190 cm
Number of heating zones: 7 (top / bottom)
Number of cooling zones: 1
Temperature range: 60 - 350°C (option: 400°C)
Temperature stabilization: ±1°C
Edge transport as standard
Description
General information
The Heller MK7 reflow oven is a pioneering reflow system with several breakthrough designs that meets all customer requirements for lower Delta T on the PCB, reduced nitrogen consumption and product setup time, in a new low - profile enclosure that facilitates visibility across the production floor. The MK7 series is highly configurable, operating with an air chamber as standard, and with nitrogen and vacuum chamber options.
HEATING SYSTEM: An improved low - profile, large - rotor heating module provides the lowest delta T in the product, as well as improved airflow and temperature uniformity
COOLING SYSTEM: Various types of modules and systems are available to suit applications, including the most demanding lead - free profiles. A special cooling option is available for heavy - duty applications that can provide cooling rates >6°C/s and output temperatures below 50°C.
TRANSPORT MODULE: High parallelism and low vibration. Single - lane and dual - lane configurations available, with center board support or mesh belt options.
FLUX MANAGEMENT SYSTEM OPTION: A revolutionary, eco - friendly flux management system using a catalyst that produces no by - products and allows flux to be removed during reflow soldering furnace operation, eliminating the risk of flux blockage.
PROCESS MONITORING SYSTEM OPTION: Developed in collaboration with KIC, the solution offers the ability to instantly obtain temperature profile parameters once basic data such as package length, width and weight are entered into the system. The optimal profile will be selected from the database of an extensive library of profiles and solder pastes with a dynamic structure
