General information
Two or Three - dimensional inspection
High inspection speed and high resolution
Camera 12 megapixels
Height measurement
Detection of direction and angle of inclination
Four - way angle camera
Minimising the stages of the inspection process
Dimensions of PCB:
Single transport system 750x560 mm
Double transport system 2x750x280 mm
Compressed air: 0.45MPa or more (filter and dehumidifier required)
Objects analysed: precision of the assembled elements, quality of the solders and elements after the oven heating process

ADVANTAGES
Three - dimensional inspection of high and slope surfaces (optional) . YSi - V takes measurements throughout the field of view, in one series. 3D imaging reliably detects displaced components that a 2D inspection can ignore. Detection is also improved where the color tone between boards and components is similar or where there is interference between print and template. The 3D inspection is also able to detect the gradient and slope direction and assess the contour (positive - negative).
YSi - V uses the industry's first 12 megapixel camera equipped with a telecentric lens. It also includes a high speed signal processing control system, an extended field of vision and other features to achieve twice the inspection capability of standard equipment.
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- Name:
  
  Dział sprzedaży
- E-mail:
  
  sklep@renex.pl
- Address:
  
  Al. Kazimierza Wielkiego 6E
- Postal code:
  
  87-800
- City:
  
  Włocławek
- Country:
  
  Poland

Description

General information

Two or Three - dimensional inspection
High inspection speed and high resolution
Camera 12 megapixels
Height measurement
Detection of direction and angle of inclination
Four - way angle camera
Minimising the stages of the inspection process
Dimensions of PCB:
Single transport system 750x560 mm
Double transport system 2x750x280 mm
Compressed air: 0.45MPa or more (filter and dehumidifier required)
Objects analysed: precision of the assembled elements, quality of the solders and elements after the oven heating process

ADVANTAGES

Three - dimensional inspection of high and slope surfaces (optional) . YSi - V takes measurements throughout the field of view, in one series. 3D imaging reliably detects displaced components that a 2D inspection can ignore. Detection is also improved where the color tone between boards and components is similar or where there is interference between print and template. The 3D inspection is also able to detect the gradient and slope direction and assess the contour (positive - negative).
YSi - V uses the industry's first 12 megapixel camera equipped with a telecentric lens. It also includes a high speed signal processing control system, an extended field of vision and other features to achieve twice the inspection capability of standard equipment.

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