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Lead-free cored wire Sn96.5 Ag3.0 Cu0.5, diameter: 0,5 mm, 500g spool

Catalog no.: CRM-HIF00495

Lead-free cored wire Sn96.5 Ag3.0 Cu0.5, diameter: 0,5 mm, 500g spool
Lead-free cored wire Sn96.5 Ag3.0 Cu0.5, diameter: 0,5 mm, 500g spool

Lead-free cored wire Sn96.5 Ag3.0 Cu0.5, diameter: 0,5 mm, 500g spool

Catalog no.: CRM-HIF00495

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  • Lead-free solder wire Sn96.5Ag3.0Cu0.5 (SAC305) – precision and durability in professional soldering

    A modern alloy for demanding applications

    Lead-free solder wire Sn96.5Ag3.0Cu0.5 (SAC305), 0.5 mm in diameter and containing 2% ROL0 flux, is a material developed specifically for the electronics and electromechanical industries. The use of high-quality tin with added silver and copper ensures stable, durable and conductive solder joints. The wire is characterized by excellent wettability and process repeatability, translating into high quality and reliability both in mass production and precision repair work.

    Physical and technical parameters

    The alloy consists of 96.5% tin, 3.0% silver and 0.5% copper, with a melting range of 217–220 °C. Its density is approximately 7.4 g/cm³, with a tensile strength of 53.3 MPa. The material also offers high ductility – elongation at break reaches 46%, which ensures resistance to mechanical stress. As a result, solder joints are strong, flexible and resistant to cracking under operational loads.

    ROL0 flux – clean and safe soldering process

    The solder contains 2% ROL0 flux compliant with J-STD-004. It is rosin-based, halogen-free and classified as No Clean. Flux residues are transparent, non-corrosive and non-conductive, eliminating the need for additional cleaning after soldering. This saves working time while maintaining high joint quality.

    Industrial-grade purity

    The solder wire is manufactured exclusively from virgin metals, ensuring outstanding chemical purity of the alloy. In practice, this reduces oxides and impurities, limiting dross formation and soldering defects. The uniform melting process ensures consistent, aesthetically pleasing and stable solder joints, which is crucial in modern electronic applications.

    Applications and usage

    With a diameter of 0.5 mm, the wire is suitable for both SMD and THT assembly as well as precise repair work. A spool weight of 500 g makes it an optimal choice for continuous use in industrial environments. It can be applied in both manual soldering and automated soldering systems.

    Environmental and technological benefits

    The SAC305 alloy is RoHS-compliant, meaning it is completely lead-free and aligned with current environmental protection standards. The combination of high metallurgical quality and ecological safety makes this solder wire the right choice wherever strict industry standards must be met.

    Lead-free solder wire Sn96.5Ag3.0Cu0.5 (SAC305) with 2% ROL0 flux delivers precision, durability and process cleanliness. With its advanced composition and high production purity, it is a reliable solution for the electronics industry and service applications, ensuring repeatability, aesthetics and safety of every solder joint.

    Product information:

    • Composition: Sn96.5Ag3Cu0.5
    • Diameter: 0,5 mm
    • Weight: 0.50 kg
    • The amount of flux in the core: 2%
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    Lead-free solder wire Sn96.5Ag3.0Cu0.5 (SAC305) – precision and durability in professional soldering

    A modern alloy for demanding applications

    Lead-free solder wire Sn96.5Ag3.0Cu0.5 (SAC305), 0.5 mm in diameter and containing 2% ROL0 flux, is a material developed specifically for the electronics and electromechanical industries. The use of high-quality tin with added silver and copper ensures stable, durable and conductive solder joints. The wire is characterized by excellent wettability and process repeatability, translating into high quality and reliability both in mass production and precision repair work.

    Physical and technical parameters

    The alloy consists of 96.5% tin, 3.0% silver and 0.5% copper, with a melting range of 217–220 °C. Its density is approximately 7.4 g/cm³, with a tensile strength of 53.3 MPa. The material also offers high ductility – elongation at break reaches 46%, which ensures resistance to mechanical stress. As a result, solder joints are strong, flexible and resistant to cracking under operational loads.

    ROL0 flux – clean and safe soldering process

    The solder contains 2% ROL0 flux compliant with J-STD-004. It is rosin-based, halogen-free and classified as No Clean. Flux residues are transparent, non-corrosive and non-conductive, eliminating the need for additional cleaning after soldering. This saves working time while maintaining high joint quality.

    Industrial-grade purity

    The solder wire is manufactured exclusively from virgin metals, ensuring outstanding chemical purity of the alloy. In practice, this reduces oxides and impurities, limiting dross formation and soldering defects. The uniform melting process ensures consistent, aesthetically pleasing and stable solder joints, which is crucial in modern electronic applications.

    Applications and usage

    With a diameter of 0.5 mm, the wire is suitable for both SMD and THT assembly as well as precise repair work. A spool weight of 500 g makes it an optimal choice for continuous use in industrial environments. It can be applied in both manual soldering and automated soldering systems.

    Environmental and technological benefits

    The SAC305 alloy is RoHS-compliant, meaning it is completely lead-free and aligned with current environmental protection standards. The combination of high metallurgical quality and ecological safety makes this solder wire the right choice wherever strict industry standards must be met.

    Lead-free solder wire Sn96.5Ag3.0Cu0.5 (SAC305) with 2% ROL0 flux delivers precision, durability and process cleanliness. With its advanced composition and high production purity, it is a reliable solution for the electronics industry and service applications, ensuring repeatability, aesthetics and safety of every solder joint.

    Product information:

    • Composition: Sn96.5Ag3Cu0.5
    • Diameter: 0,5 mm
    • Weight: 0.50 kg
    • The amount of flux in the core: 2%
    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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