Lead-free cored wire Sn96.5 Ag3.0 Cu0.5, diameter: 1.0 mm, 500g spool – professionalism without compromise

Efficiency, precision, and safety in soldering processes

Lead-free solder wire Sn96.5 Ag3.0 Cu0.5 (SAC305) with a diameter of 1.0 mm and 2% ROL0 flux has been developed for environments where durability, process cleanliness, and compliance with industry standards are essential. The optimized alloy composition and controlled production guarantee reliable, conductive, and mechanically strong solder joints, making it a preferred choice for industrial and service applications.

Optimal composition and mechanical properties

The alloy contains 96.5% tin, 3.0% silver, and 0.5% copper, ensuring durable, conductive, and crack-resistant connections. High-purity metals provide homogeneous solder joints and stable electrical conductivity, ensuring the reliability of finished electronic assemblies.

Advanced ROL0 flux

The integrated 2% ROL0 flux, halogen-free and rosin-based, fully complies with J-STD-004. It leaves transparent, non-corrosive residues that do not require cleaning and do not affect electrical properties. This improves wetting, accelerates the soldering process, and enhances the quality of solder joints, even on challenging or oxidized surfaces.

Process stability and soldering performance

With a melting range of 217–220°C, the wire is suitable for a wide range of substrates and components. It offers fast wetting, even tin distribution, and aesthetically clean solder joints, ensuring repeatability in both manual and automated soldering applications.

Convenient spool size – 500 g

The 500 g spool provides sufficient material for continuous operation without frequent replacement. This format increases efficiency and is well-suited for professional environments such as production lines, laboratories, and service workshops.

Applications and compliance

This solder wire is ideal for THT and SMD assembly, rework, repair, and various industrial processes. Fully RoHS compliant and lead-free, it supports sustainable production practices and meets modern environmental requirements.

Lead-free cored wire Sn96.5 Ag3.0 Cu0.5 with 2% ROL0 flux, diameter 1.0 mm, in a 500 g spool combines mechanical strength, purity, and reliability. It ensures long-lasting, repeatable, and clean solder joints, meeting the expectations of demanding industrial and service environments.

Product information:

Composition: Sn96.5Ag3Cu0.5

Diameter: 1.0 mm

Weight: 0.50 kg

The amount of flux in the core: 2%
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- Name:
  
  Dział sprzedaży
- E-mail:
  
  sklep@renex.pl
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  Al. Kazimierza Wielkiego 6E
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  Włocławek
- Country:
  
  Poland

Description

Lead-free cored wire Sn96.5 Ag3.0 Cu0.5, diameter: 1.0 mm, 500g spool – professionalism without compromise

Efficiency, precision, and safety in soldering processes

Lead-free solder wire Sn96.5 Ag3.0 Cu0.5 (SAC305) with a diameter of 1.0 mm and 2% ROL0 flux has been developed for environments where durability, process cleanliness, and compliance with industry standards are essential. The optimized alloy composition and controlled production guarantee reliable, conductive, and mechanically strong solder joints, making it a preferred choice for industrial and service applications.

Optimal composition and mechanical properties

The alloy contains 96.5% tin, 3.0% silver, and 0.5% copper, ensuring durable, conductive, and crack-resistant connections. High-purity metals provide homogeneous solder joints and stable electrical conductivity, ensuring the reliability of finished electronic assemblies.

Advanced ROL0 flux

The integrated 2% ROL0 flux, halogen-free and rosin-based, fully complies with J-STD-004. It leaves transparent, non-corrosive residues that do not require cleaning and do not affect electrical properties. This improves wetting, accelerates the soldering process, and enhances the quality of solder joints, even on challenging or oxidized surfaces.

Process stability and soldering performance

With a melting range of 217–220°C, the wire is suitable for a wide range of substrates and components. It offers fast wetting, even tin distribution, and aesthetically clean solder joints, ensuring repeatability in both manual and automated soldering applications.

Convenient spool size – 500 g

The 500 g spool provides sufficient material for continuous operation without frequent replacement. This format increases efficiency and is well-suited for professional environments such as production lines, laboratories, and service workshops.

Applications and compliance

This solder wire is ideal for THT and SMD assembly, rework, repair, and various industrial processes. Fully RoHS compliant and lead-free, it supports sustainable production practices and meets modern environmental requirements.

Lead-free cored wire Sn96.5 Ag3.0 Cu0.5 with 2% ROL0 flux, diameter 1.0 mm, in a 500 g spool combines mechanical strength, purity, and reliability. It ensures long-lasting, repeatable, and clean solder joints, meeting the expectations of demanding industrial and service environments.