REECO BN19 nozzle for BGA - precision nozzle for larger BGA and TQFP packages
The REECO BN19 nozzle for BGA is designed for the assembly and removal of larger BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions ensure uniform hot-air distribution across the entire component, supporting safe and repeatable soldering and rework processes.
The BN19 nozzle is compatible with REECO HOT-AIR systems and is suitable for electronics repair centers, laboratories, and manufacturing facilities involved in SMD component assembly and repair.
Open design for uniform heat distribution
The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open design allows hot air to flow through specially engineered channels, enabling the nozzle to rest directly on the PCB surface during operation.
This design provides uniform heating across the entire package while directing hot air precisely to the target component, minimizing thermal impact on adjacent devices.
Stable and repeatable rework processes
The nozzle's dimensions are carefully matched to larger components, providing excellent control during hot-air soldering operations. Precision manufacturing supports consistent assembly and component removal while improving process repeatability for modern electronic assemblies that require precise thermal distribution.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design allowing direct contact with the PCB surface
- Uniform hot air distribution
- Precise hot air delivery across the entire component
- Suitable for SMD/BGA assembly and rework processes
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 17.20 × 17.20 mm |
| External dimensions | 22.10 × 22.10 mm |
The REECO BN19 nozzle for BGA is designed for precision hot air rework of larger electronic packages. Its open construction and optimized hot-air distribution provide accurate, uniform heating for BGA assembly and removal, ensuring reliable, repeatable performance in professional REECO HOT-AIR systems.
