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REECO BN21 nozzle for BGA

Catalog no.: RE-BN21

REECO BN21 nozzle for BGA
REECO BN21 nozzle for BGA

REECO BN21 nozzle for BGA

Catalog no.: RE-BN21

Net price: 72,00 EUR Gross price: 88,56 EUR

Manufacturer: Reeco

Delivery 14 - 21 days
  • Description
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  • REECO BN21 nozzle for BGA - HOT-AIR nozzle for larger BGA components

    The REECO BN21 nozzle for BGA is designed for use with BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions allow the nozzle to precisely match the target package, supporting accurate assembly, removal, and hot-air rework operations.

    The BN21 nozzle is designed for use with REECO HOT-AIR systems and is ideal for electronics repair centers, manufacturing facilities, and laboratories that work with modern electronic assemblies.

    Design for efficient heat distribution

    The RE-BN (BGA Nozzle) series has been specifically developed for BGA applications. Its square profile and open design allow hot air to flow through specially engineered channels surrounding the target component.

    This construction enables the nozzle to rest directly on the PCB surface, ensuring uniform heating of the entire package while providing greater control over the soldering process.

    Optimized for professional rework applications

    The carefully selected dimensions of the REECO BN21 nozzle for BGA make it suitable for larger BGA packages that require even heat distribution. Precision manufacturing supports consistent rework results while minimizing the risk of overheating adjacent components outside the target area.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design with dedicated hot air flow channels
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 19.5 × 19.5 mm
    External dimensions 24.1 × 24.1 mm

    The REECO BN21 nozzle for BGA enables precise hot air soldering and rework wherever accurate temperature control and uniform heating of larger electronic packages are required. Its specialized design makes it a practical accessory for professional service and production workstations equipped with REECO HOT-AIR systems.

    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    REECO BN21 nozzle for BGA - HOT-AIR nozzle for larger BGA components

    The REECO BN21 nozzle for BGA is designed for use with BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions allow the nozzle to precisely match the target package, supporting accurate assembly, removal, and hot-air rework operations.

    The BN21 nozzle is designed for use with REECO HOT-AIR systems and is ideal for electronics repair centers, manufacturing facilities, and laboratories that work with modern electronic assemblies.

    Design for efficient heat distribution

    The RE-BN (BGA Nozzle) series has been specifically developed for BGA applications. Its square profile and open design allow hot air to flow through specially engineered channels surrounding the target component.

    This construction enables the nozzle to rest directly on the PCB surface, ensuring uniform heating of the entire package while providing greater control over the soldering process.

    Optimized for professional rework applications

    The carefully selected dimensions of the REECO BN21 nozzle for BGA make it suitable for larger BGA packages that require even heat distribution. Precision manufacturing supports consistent rework results while minimizing the risk of overheating adjacent components outside the target area.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design with dedicated hot air flow channels
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 19.5 × 19.5 mm
    External dimensions 24.1 × 24.1 mm

    The REECO BN21 nozzle for BGA enables precise hot air soldering and rework wherever accurate temperature control and uniform heating of larger electronic packages are required. Its specialized design makes it a practical accessory for professional service and production workstations equipped with REECO HOT-AIR systems.

    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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