REECO BN25 nozzle for BGA - HOT-AIR nozzle for precision work with BGA packages
The REECO BN25 nozzle for BGA is designed for the assembly and removal of BGA packages and similar components, including TQFP devices. Its carefully optimized dimensions provide an accurate fit for larger packages, ensuring uniform heat transfer during hot air soldering and rework operations.
The nozzle is ideal for professional electronics repair centers, production facilities, and laboratories performing repair and rework of modern printed circuit boards.
Efficient hot air distribution
The RE-BN (BGA Nozzle) series has been specifically developed for BGA applications. Its square profile and open design allow hot air to flow through strategically positioned channels, providing even heating across the entire component.
The nozzle can rest directly on the PCB surface, concentrating heat on the target package while minimizing thermal impact on adjacent components.
Consistent assembly and rework processes
The optimized nozzle geometry supports stable soldering performance and repeatable assembly and repair operations. The REECO BN25 nozzle for BGA enables precise hot air rework, ensuring reliable replacement and installation of electronic packages when used with REECO HOT-AIR systems.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design with dedicated hot air flow channels
- Allows direct contact with the PCB surface
- Uniform heating across the entire package
- Compatible with REECO HOT-AIR systems
- Suitable for professional SMD/BGA assembly and rework processes
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 23.1 × 23.1 mm |
| External dimensions | 28.1 × 28.1 mm |
The REECO BN25 nozzle for BGA is designed for precise hot air soldering and rework applications. Its specialized construction provides uniform heating for larger BGA packages, improving the accuracy and repeatability of assembly and repair processes using professional REECO HOT-AIR systems.
