REECO BN5 nozzle for BGA - precision nozzle for small BGA packages
The REECO BN5 nozzle for BGA is designed for working with small BGA packages and similar components such as TQFP. Its compact working dimensions allow hot air to be directed precisely onto small soldering areas, making it ideal for the assembly, removal, and rework of miniature electronic components.
The nozzle is compatible with REECO HOT-AIR systems and is intended for use in electronics service centers, laboratories, and production environments where high precision is essential.
Focused hot air distribution
The BN5 belongs to the RE-BN (BGA Nozzle) series, developed specifically for BGA applications. Its square profile and open construction allow hot air to flow through specially engineered channels, ensuring uniform heating across the entire component.
The nozzle can sit directly on the PCB surface, concentrating thermal energy precisely on the target package. This improves process accuracy while minimizing heat exposure to adjacent components.
Ideal for precision electronics rework
Thanks to its compact dimensions, the BN5 is particularly well-suited for handling small electronic packages that require accurate temperature distribution. Its optimized geometry supports stable process conditions and helps achieve consistent, repeatable results during assembly, repair, and rework operations.
Key product features
- Designed for BGA, TQFP, and similar packages
- Optimized for small electronic components
- Square nozzle profile
- Open design with dedicated hot air distribution channels
- Allows direct contact with the PCB surface
- Uniform heating across the entire component
- Compatible with REECO HOT-AIR systems
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 3.5 × 3.5 mm |
| External dimensions | 8.3 × 8.3 mm |
Precision where every millimeter matters
The REECO BN5 nozzle for BGA has been developed to work with the smallest electronic packages that require highly accurate hot-air soldering. Its focused airflow and open construction make it an excellent choice for precision assembly, repair, and rework applications using REECO HOT-AIR systems.
