REECO RA250 hot air assembly and disassembly station
Advanced HOT-AIR station for professional electronics rework
The REECO RA250 hot air assembly and disassembly station is designed for demanding SMD assembly, desoldering, and electronic rework applications. Combining high heating power, intelligent control, and advanced programming capabilities, it is suitable for everything from small CHIP components to large BGA packages mounted on multilayer PCBs.
The station is ideal for electronics repair centers, research and development laboratories, and production facilities where process repeatability and precise thermal control are essential.
Three operating modes for maximum flexibility
One of the key advantages of the REECO RA250 is its ability to operate in multiple modes, allowing users to select the most appropriate workflow for each application. Operators can work manually or use predefined soldering profiles to simplify repetitive processes.
Available operating modes include:
- Manual mode
- Time mode based on a programmed profile
- Profile mode
When connected to a computer using dedicated software, the station allows users to create, edit, store, and manage virtually unlimited soldering profiles while monitoring the process in real time. This provides greater process consistency and simplifies optimization for different PCB assemblies.
Precise process control
The REECO RA250 is equipped with an 800 W heating element controlled by a microprocessor that continuously regulates both temperature and airflow. The wide airflow adjustment range allows delicate soldering of small SMD components without displacement while also providing sufficient thermal capacity for safely removing large components mounted on high thermal-mass PCBs.
A clear display presents all essential operating parameters, giving the operator continuous control throughout the soldering process.
Integrated vacuum pickup system
The station includes a built-in vacuum pickup tool for safe lifting and positioning of delicate electronic components. The vacuum function can be activated manually or automatically, making it easier to handle sensitive devices while reducing the risk of mechanical damage.
The REECO RA250 can also be combined with a PCB preheater and a dedicated support stand to create a complete professional rework workstation for advanced repair applications.
Key product features:
- 800 W heating power
- Temperature range: 100-450°C
- Microprocessor-controlled temperature and airflow regulation
- Three operating modes: manual, timed, and profile
- Programmable soldering profiles
- PC connectivity with dedicated software
- Real-time process monitoring
- Integrated vacuum pickup tool
- Suitable for CHIP, SO, QFP, PLCC, and BGA components
- Compatible with PCB preheaters and dedicated support stands
Technical specifications
| Parameter | Value |
|---|---|
| Application | SMD assembly and component removal |
| Power | 800 W |
| Temperature range | 100-450°C |
| Control | Microprocessor-controlled |
| Operating modes | Manual, timed, profile |
| Weight | 4.93 kg |
Standard package includes:
- REECO RA250 station
- Vacuum pickup tool
- Thermocouple
- Set of vacuum cups (3 sizes)
- Nozzle
- REECO nozzle adapter
Professional solution for advanced soldering and rework
The REECO RA250 hot air assembly and disassembly station is designed for professionals who require precise thermal control, advanced process programming, and reliable performance. With programmable soldering profiles, PC connectivity, integrated vacuum pickup, and compatibility with PCB preheaters, it provides an efficient solution for repairing and reworking modern electronic assemblies—from miniature SMD components to complex BGA devices.
