REECO RS-300 SMD/BGA assembly and disassembly kit - comprehensive workstation for professional SMD/BGA rework
The REECO RS-300 SMD/BGA assembly and disassembly kit is designed for precision soldering, rework, repair, and replacement of electronic components. The system integrates a HOT-AIR station, a three-zone quartz preheater, and a control computer, providing a complete solution for working with SMD and BGA packages. Thanks to its high heating capacity and advanced process control, the system is suitable for electronics repair centers, laboratories, R&D departments, and production facilities.
High-performance heating system for demanding applications
At the core of the system is a 3.4 kW three-zone quartz preheater with a heating area equivalent to the A3 format, ensuring even heating of large PCBs while minimizing the risk of thermal stress during component assembly and removal.
The upper HOT-AIR module, rated at up to 600 W, delivers precisely controlled hot air without direct contact with the component. Smooth adjustment of the bottom heater temperature and airflow enables optimization of process parameters for different PCB types and electronic components.
Precise process control
The REECO RS-300 SMD/BGA assembly and disassembly kit features an integrated control computer with a 7-inch color touchscreen, providing intuitive operation and complete control of the soldering process. The software supports creating and storing an unlimited number of process profiles, with real-time editing to optimize parameters across various PCB assemblies and component types.
The system is also equipped with three external thermocouple inputs, enabling continuous temperature monitoring at selected points throughout the entire rework process.
Ergonomic design and reliable operation
A stable positioning stand with X-, Y-, and Z-axis adjustments allows precise alignment of the heating head over the target component. Heating heads can be replaced within seconds using a dedicated adapter, while a wide selection of nozzles makes the system suitable for a variety of rework applications.
The system also features an automatic heater cooling function after power-off, extending the heating element's service life and improving overall reliability.
Key product features
- Integrated HOT-AIR station, quartz preheater, and control computer.
- 3.4 kW three-zone quartz preheater.
- A3-size heating area.
- Upper HOT-AIR module with up to 600 W output.
- Smooth temperature and airflow adjustment.
- Three external thermocouple inputs.
- 7-inch color touchscreen display.
- Unlimited storage of process profiles.
- Real-time process parameter editing.
- X, Y, and Z-axis adjustable positioning stand.
- Quick replacement of heating heads.
- Automatic heating element cooling function.
Technical specifications
| Parameter | Value |
|---|---|
| Application | SMD/BGA assembly and disassembly |
| Bottom heater power | 3.4 kW |
| Upper heater power | Up to 600 W |
| Heating area | A3 format |
| Operating temperature range | 100-350°C |
| Thermocouple inputs | 3 |
| Display | 7" color touchscreen |
| Weight | 19 kg |
Standard package includes:
- REECO RS-300Q unit
- Power cable
- REECO nozzle adapter
- RE-PN50 nozzle
- Complete stand set
Reliable solution for professional electronics rework
The REECO RS-300 SMD/BGA assembly and disassembly kit provides a complete solution for professional electronics rework and repair. Combining an integrated heating system, advanced process control, and unlimited programmable process profiles, it delivers the precision and repeatability required for working with CHIP, SO, QFP, PLCC, and BGA components.
