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REECO BN11 nozzle for BGA

Catalog no.: RE-BN11

REECO BN11 nozzle for BGA
REECO BN11 nozzle for BGA

REECO BN11 nozzle for BGA

Catalog no.: RE-BN11

Net price: 72,00 EUR Gross price: 88,56 EUR

Manufacturer: Reeco

Delivery 14 - 21 days
  • Description
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  • REECO BN11 nozzle for BGA - precise hot air delivery for BGA rework

    The REECO BN11 nozzle for BGA is designed for the precise installation and removal of BGA packages and similar components, including TQFP devices. Its carefully engineered dimensions and nozzle design ensure uniform hot air distribution across the target component, improving soldering accuracy and rework quality.

    The BN11 nozzle is designed for use with REECO HOT-AIR systems, supporting consistent and repeatable production and repair processes.

    Optimized design for BGA packages

    The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open construction allows hot air to flow through dedicated channels, enabling the nozzle to rest directly on the PCB surface during operation.

    This design ensures even heating of the entire component while directing hot air precisely to the target area, minimizing heat exposure to surrounding components.

    Stable and repeatable performance

    The precision-manufactured REECO BN11 nozzle for BGA helps maintain stable process parameters during the assembly and removal of electronic components. Proper nozzle sizing improves rework accuracy and process repeatability, making it well-suited for professional electronics repair and manufacturing environments.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design allowing direct contact with the PCB surface
    • Uniform hot air distribution
    • Precise hot air delivery to the target component
    • Suitable for SMD/BGA assembly and rework processes

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 9.10 × 9.10 mm
    External dimensions 14.10 × 14.10 mm

    The REECO BN11 nozzle for BGA enables precise assembly and removal of electronic components that require uniform heating across the entire package. Thanks to its specialized design and optimized hot-air flow, it is a practical accessory for service and production workstations that use REECO HOT-AIR systems.

    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    REECO BN11 nozzle for BGA - precise hot air delivery for BGA rework

    The REECO BN11 nozzle for BGA is designed for the precise installation and removal of BGA packages and similar components, including TQFP devices. Its carefully engineered dimensions and nozzle design ensure uniform hot air distribution across the target component, improving soldering accuracy and rework quality.

    The BN11 nozzle is designed for use with REECO HOT-AIR systems, supporting consistent and repeatable production and repair processes.

    Optimized design for BGA packages

    The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open construction allows hot air to flow through dedicated channels, enabling the nozzle to rest directly on the PCB surface during operation.

    This design ensures even heating of the entire component while directing hot air precisely to the target area, minimizing heat exposure to surrounding components.

    Stable and repeatable performance

    The precision-manufactured REECO BN11 nozzle for BGA helps maintain stable process parameters during the assembly and removal of electronic components. Proper nozzle sizing improves rework accuracy and process repeatability, making it well-suited for professional electronics repair and manufacturing environments.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design allowing direct contact with the PCB surface
    • Uniform hot air distribution
    • Precise hot air delivery to the target component
    • Suitable for SMD/BGA assembly and rework processes

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 9.10 × 9.10 mm
    External dimensions 14.10 × 14.10 mm

    The REECO BN11 nozzle for BGA enables precise assembly and removal of electronic components that require uniform heating across the entire package. Thanks to its specialized design and optimized hot-air flow, it is a practical accessory for service and production workstations that use REECO HOT-AIR systems.

    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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