REECO BN43 nozzle for BGA - precision nozzle for assembly and rework of large BGA packages
The REECO BN43 nozzle for BGA is designed for working with large BGA packages and similar components such as TQFP. Its optimized dimensions ensure precise alignment with the target component, providing a uniform temperature distribution during assembly, removal, and hot-air rework operations.
The nozzle is intended for use with REECO HOT-AIR systems in electronics service centers, laboratories, and manufacturing facilities involved in the repair and assembly of advanced electronic assemblies.
Optimized design for efficient heat distribution
The BN43 belongs to the RE-BN series, specifically developed for BGA applications. Its square profile and open construction allow hot air to flow through specially engineered channels, ensuring even heat distribution across the entire package.
The nozzle can sit directly on the PCB surface, directing the hot air stream precisely onto the component. This design provides uniform heating while improving process control and minimizing thermal impact on surrounding components.
Reliable support for assembly and rework
The optimized geometry of the REECO BN43 nozzle enables stable and repeatable soldering processes. Precise hot air delivery helps reduce the risk of overheating adjacent components while improving the safety and consistency of assembly and rework operations involving demanding electronic packages.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design for uniform hot air distribution
- Allows direct contact with the PCB surface
- Uniform heating across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 41.5 × 41.5 mm |
| External dimensions | 46.6 × 46.6 mm |
The right nozzle makes a difference
Selecting a nozzle that matches the component's dimensions is essential for achieving reliable hot-air soldering results. The REECO BN43 nozzle for BGA delivers efficient heat distribution across larger BGA packages, supporting consistent, high-quality assembly and rework processes with REECO HOT-AIR systems.
