REECO BN39 nozzle for BGA - precision nozzle for assembly and rework of large BGA packages
The REECO BN39 nozzle for BGA is designed for professional assembly, removal, and rework of BGA packages and similar components such as TQFP. Its optimized working dimensions allow the nozzle to precisely match larger components, ensuring uniform heating during HOT-AIR soldering and rework processes.
The BN39 is intended for use in electronics service centers, laboratories, and manufacturing environments performing repair and replacement of modern electronic assemblies.
Focused hot air distribution
The nozzle belongs to the RE-BN series, specifically engineered for BGA applications. Its square profile and open construction allow hot air to flow through specially designed channels, providing uniform temperature distribution throughout the component.
The nozzle can sit directly on the PCB surface, precisely focusing the hot air stream on the target package. This improves process efficiency while minimizing thermal impact on surrounding components.
Reliable performance for professional rework
The optimized geometry of the BN39 supports stable and repeatable soldering processes. It is particularly well-suited for replacing larger BGA packages that require precise temperature control and consistent heat distribution throughout the rework process.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design for uniform hot air distribution
- Allows direct contact with the PCB surface
- Even heating across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 37.6 × 37.6 mm |
| External dimensions | 42.5 × 42.5 mm |
Reliable solution for larger BGA packages
The REECO BN39 nozzle for BGA has been developed for professionals involved in electronics assembly and repair. Its open construction and optimized hot air distribution provide uniform heating of larger BGA packages, helping deliver precise, repeatable, and reliable rework results with REECO HOT-AIR systems.
