Categories

REECO BN13 nozzle for BGA

Catalog no.: RE-BN13

REECO BN13 nozzle for BGA
REECO BN13 nozzle for BGA

REECO BN13 nozzle for BGA

Catalog no.: RE-BN13

Net price: 72,00 EUR Gross price: 88,56 EUR

Manufacturer: Reeco

Delivery 14 - 21 days
  • Description
  • Ask for product
  • Responsible
    person
  • REECO BN13 nozzle for BGA - precise nozzle for BGA assembly and rework

    The REECO BN13 nozzle for BGA is designed for precise assembly and removal of BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions ensure even distribution of hot air across the entire package, improving process control during soldering and rework operations.

    The BN13 nozzle is designed for use with REECO HOT-AIR systems and is suitable for professional electronics repair centers, laboratories, and manufacturing environments.

    Open design for efficient heating

    The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open design allows hot air to flow through specially engineered channels, enabling the nozzle to rest directly on the PCB surface during operation.

    This configuration concentrates the hot air flow across the entire package, providing uniform heating while minimizing thermal impact on adjacent components.

    Consistent and repeatable rework processes

    The precision-manufactured REECO BN13 nozzle for BGA enables repeatable rework and component replacement. Proper nozzle sizing improves process stability and enhances accuracy when repairing modern printed circuit boards.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design allowing direct contact with the PCB surface
    • Uniform hot air distribution
    • Precise hot air delivery across the entire component
    • Suitable for SMD/BGA assembly and rework processes

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 11 × 11 mm
    External dimensions 16.10 × 16.10 mm

    The REECO BN13 nozzle for BGA enables precise assembly and removal of electronic components that require uniform heating across the entire package. Thanks to its open design and optimized hot-air flow, it improves the accuracy and repeatability of rework processes performed using professional REECO HOT-AIR systems.

    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    REECO BN13 nozzle for BGA - precise nozzle for BGA assembly and rework

    The REECO BN13 nozzle for BGA is designed for precise assembly and removal of BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions ensure even distribution of hot air across the entire package, improving process control during soldering and rework operations.

    The BN13 nozzle is designed for use with REECO HOT-AIR systems and is suitable for professional electronics repair centers, laboratories, and manufacturing environments.

    Open design for efficient heating

    The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open design allows hot air to flow through specially engineered channels, enabling the nozzle to rest directly on the PCB surface during operation.

    This configuration concentrates the hot air flow across the entire package, providing uniform heating while minimizing thermal impact on adjacent components.

    Consistent and repeatable rework processes

    The precision-manufactured REECO BN13 nozzle for BGA enables repeatable rework and component replacement. Proper nozzle sizing improves process stability and enhances accuracy when repairing modern printed circuit boards.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design allowing direct contact with the PCB surface
    • Uniform hot air distribution
    • Precise hot air delivery across the entire component
    • Suitable for SMD/BGA assembly and rework processes

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 11 × 11 mm
    External dimensions 16.10 × 16.10 mm

    The REECO BN13 nozzle for BGA enables precise assembly and removal of electronic components that require uniform heating across the entire package. Thanks to its open design and optimized hot-air flow, it improves the accuracy and repeatability of rework processes performed using professional REECO HOT-AIR systems.

    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

Recommended products: