REECO BN41 nozzle for BGA - precision nozzle for assembly and rework of large BGA packages
The REECO BN41 nozzle for BGA is designed for professional assembly, removal, and repair of large BGA packages and similar components such as TQFP. Its optimized dimensions allow the nozzle to fit larger components precisely, ensuring uniform hot air distribution throughout the soldering and rework process.
The nozzle is intended for use with REECO HOT-AIR systems in electronics service centers, laboratories, and manufacturing facilities.
Engineered for uniform heat distribution
The BN41 belongs to the RE-BN series, developed specifically for BGA applications. Its square profile and open construction allow hot air to flow through specially designed channels, providing even heat distribution across the entire package.
The nozzle can sit directly on the PCB surface, focusing the hot air stream precisely on the target component. This improves process efficiency while minimizing thermal impact on adjacent components.
Stable and repeatable rework performance
The precision-machined REECO BN41 nozzle supports stable assembly and rework processes. Its optimized geometry provides excellent control over the soldering process, making it particularly suitable for handling large and demanding electronic packages where process consistency is essential.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design with dedicated hot air distribution channels
- Allows direct contact with the PCB surface
- Uniform heating across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 39.5 × 39.5 mm |
| External dimensions | 44.6 × 44.6 mm |
Reliable support for electronics rework
The REECO BN41 nozzle for BGA has been developed for professionals who require precise, repeatable results when working with large electronic packages. Its open construction and optimized hot-air distribution enable efficient soldering and rework, improving process reliability and the quality of electronics repair and manufacturing operations.
