REECO BN15 nozzle for BGA - precision nozzle for BGA and TQFP packages
The REECO BN15 nozzle for BGA is designed for the precise assembly and removal of BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions ensure uniform hot-air distribution throughout the package, supporting safe and repeatable soldering and rework processes.
The BN15 nozzle is an accessory for REECO HOT-AIR systems and is suitable for electronics repair centers, laboratories, and manufacturing facilities performing SMD component repair and replacement.
Open design for uniform heating
The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open design allows hot air to flow through specially engineered channels, enabling the nozzle to rest directly on the PCB surface during operation.
This design provides uniform heating across the entire electronic package while directing hot air precisely to the target component and minimizing thermal exposure to adjacent devices.
Consistent and reliable rework
The precision-manufactured REECO BN15 nozzle for BGA enables stable, repeatable assembly and component removal. Its carefully matched dimensions allow the nozzle to fit the package accurately, improving process control during hot air soldering and rework operations.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design allowing direct contact with the PCB surface
- Uniform hot air distribution
- Precise hot air delivery across the entire component
- Suitable for SMD/BGA assembly and rework processes
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 13.20 × 13.20 mm |
| External dimensions | 18.20 × 18.20 mm |
The REECO BN15 nozzle for BGA is designed for precision hot air rework applications. Its open construction and optimized hot air distribution enable accurate assembly and removal of BGA packages, delivering excellent process control and repeatability in professional REECO HOT-AIR systems.
