REECO BN47 nozzle for BGA - precision nozzle for assembly and rework of large BGA packages
The REECO BN47 nozzle for BGA is designed for the assembly, removal, and rework of large BGA packages and similar components, such as TQFP packages. Its optimized working dimensions allow the nozzle to fit the target component precisely, ensuring uniform heat distribution throughout the package during hot-air soldering operations.
The nozzle is intended for professional workstations equipped with REECO HOT-AIR systems used in electronics manufacturing, repair, and laboratory environments.
Design optimized for efficient heat distribution
The BN47 belongs to the RE-BN (BGA Nozzle) series, which features a square profile and an open construction. Hot air is delivered through specially engineered channels, allowing the nozzle to sit directly on the PCB surface.
This design ensures uniform heating of the entire component, improves process control, and supports highly accurate soldering and rework operations.
Built for professional HOT-AIR applications
The REECO BN47 nozzle is engineered for intensive use in production and service environments. Its optimized geometry promotes consistent process repeatability while effectively heating larger electronic packages that require precise, even temperature distribution.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design with dedicated hot air distribution channels
- Allows direct contact with the PCB surface
- Uniform heat distribution across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 45.5 × 45.5 mm |
| External dimensions | 50.7 × 50.7 mm |
Precision for large electronic packages
The REECO BN47 nozzle for BGA enables precise hot air soldering and rework of large electronic packages. Its open construction and optimized heat distribution improve process control while helping achieve reliable, repeatable results in professional electronics assembly and repair using REECO HOT-AIR systems.
