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REECO BN23 nozzle for BGA

Catalog no.: RE-BN23

REECO BN23 nozzle for BGA
REECO BN23 nozzle for BGA

REECO BN23 nozzle for BGA

Catalog no.: RE-BN23

Net price: 72,00 EUR Gross price: 88,56 EUR

Manufacturer: Reeco

Delivery 14 - 21 days
  • Description
  • Ask for product
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  • REECO BN23 nozzle for BGA - efficient heating for larger BGA packages

    The REECO BN23 nozzle for BGA is designed for use with larger BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions direct the hot airflow across the entire package, ensuring uniform heating during assembly, removal, and rework operations.

    Designed for use with REECO HOT-AIR systems, this accessory is ideal wherever high precision and repeatable soldering performance are required.

    Engineered specifically for BGA rework

    The BN23 belongs to the RE-BN (BGA Nozzle) series, distinguished by its square profile and open design. Specially engineered air channels distribute hot air evenly around the target component, providing consistent heating across the entire package.

    Because the nozzle can rest directly on the PCB surface, thermal energy is delivered precisely where it is needed while minimizing heat exposure to surrounding electronic components.

    Reliable support for electronics repair

    The REECO BN23 nozzle for BGA is well-suited for both repair applications and production processes involving the replacement or installation of BGA packages. Its optimized nozzle geometry helps maintain stable process parameters and improves the repeatability of hot air rework operations.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design for uniform hot air distribution
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 21.4 × 21.4 mm
    External dimensions 26.5 × 26.5 mm

    The REECO BN23 nozzle for BGA is designed for precision hot air rework applications. Its open construction and optimized airflow provide uniform heating of larger BGA packages, supporting high-quality, repeatable assembly and repair processes in professional REECO HOT-AIR systems.

    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    REECO BN23 nozzle for BGA - efficient heating for larger BGA packages

    The REECO BN23 nozzle for BGA is designed for use with larger BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions direct the hot airflow across the entire package, ensuring uniform heating during assembly, removal, and rework operations.

    Designed for use with REECO HOT-AIR systems, this accessory is ideal wherever high precision and repeatable soldering performance are required.

    Engineered specifically for BGA rework

    The BN23 belongs to the RE-BN (BGA Nozzle) series, distinguished by its square profile and open design. Specially engineered air channels distribute hot air evenly around the target component, providing consistent heating across the entire package.

    Because the nozzle can rest directly on the PCB surface, thermal energy is delivered precisely where it is needed while minimizing heat exposure to surrounding electronic components.

    Reliable support for electronics repair

    The REECO BN23 nozzle for BGA is well-suited for both repair applications and production processes involving the replacement or installation of BGA packages. Its optimized nozzle geometry helps maintain stable process parameters and improves the repeatability of hot air rework operations.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design for uniform hot air distribution
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 21.4 × 21.4 mm
    External dimensions 26.5 × 26.5 mm

    The REECO BN23 nozzle for BGA is designed for precision hot air rework applications. Its open construction and optimized airflow provide uniform heating of larger BGA packages, supporting high-quality, repeatable assembly and repair processes in professional REECO HOT-AIR systems.

    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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