REECO BN27 nozzle for BGA - precision nozzle for larger BGA packages
The REECO BN27 nozzle for BGA is designed for the assembly and removal of larger BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions ensure accurate hot air delivery across the entire package, supporting safe and repeatable soldering and rework processes.
The nozzle is compatible with REECO HOT-AIR systems and is intended for use in electronics repair centers, laboratories, and manufacturing facilities performing SMD component repair and replacement.
Open design for efficient heat distribution
The BN27 is part of the RE-BN (BGA Nozzle) series, specifically developed for BGA applications. Its square profile and open design allow hot air to flow through dedicated channels positioned around the nozzle.
This construction enables the nozzle to rest directly on the PCB surface, providing uniform heating across the entire package. As a result, thermal energy is delivered precisely where it is needed while minimizing heat exposure to surrounding components.
Designed for repair and production applications
The precision-manufactured REECO BN27 nozzle for BGA supports stable assembly and repair processes. Its optimized nozzle geometry delivers consistent results when working with larger BGA packages, improving the quality and repeatability of professional rework operations.
Key product features
Designed for BGA, TQFP, and similar packages
Square nozzle profile
Open design with dedicated hot air flow channels
Allows direct contact with the PCB surface
Uniform heating across the entire package
Compatible with REECO HOT-AIR systems
Suitable for professional SMD/BGA assembly and rework processes
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 25.1 × 25.1 mm |
| External dimensions | 30.5 × 30.5 mm |
The REECO BN27 nozzle for BGA is designed for precision work with larger electronic packages that require uniform heat distribution. Its specialized open construction directs hot air evenly across the entire component, improving the accuracy and repeatability of soldering and rework processes performed with professional REECO HOT-AIR systems.
