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REECO BN9 nozzle for BGA

Catalog no.: RE-BN9

REECO BN9 nozzle for BGA
REECO BN9 nozzle for BGA

REECO BN9 nozzle for BGA

Catalog no.: RE-BN9

Net price: 72,00 EUR Gross price: 88,56 EUR

Manufacturer: Reeco

Delivery 14 - 21 days
  • Description
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  • REECO BN9 nozzle for BGA - precision nozzle for BGA assembly and rework

    The REECO BN9 nozzle for BGA is designed for precise work with BGA packages and similar components, such as TQFP packages. Its carefully selected working dimensions ensure uniform heating throughout the package, which is essential during hot-air assembly, removal, and rework operations.

    The BN9 is intended for use with REECO HOT-AIR systems and is suitable for professional electronics repair centers, production facilities, and laboratories.

    Efficient hot air distribution

    The BN9 belongs to the RE-BN (BGA Nozzle) series, developed specifically for BGA applications. Its square profile and open design allow hot air to flow through dedicated channels, enabling the nozzle to sit directly on the PCB surface while delivering even heat distribution across the entire component.

    This design improves process accuracy while minimizing heat exposure to adjacent components.

    Reliable performance for HOT-AIR applications

    The nozzle's optimized construction supports stable and repeatable soldering processes, making it ideal for components that require precise temperature control. The BN9 performs equally well during BGA replacement and other hot air rework applications.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design with dedicated hot air distribution channels
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems
    • Suitable for professional assembly, removal, and rework applications
    • Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 7.65 × 7.65 mm
    External dimensions 12.4 × 12.4 mm

    Precision that improves process quality

    The REECO BN9 nozzle for BGA has been developed for users who require accurate hot air soldering and rework of small BGA packages. Its open construction and optimized heat distribution ensure effective, repeatable operation while providing excellent process control for professional production and electronics repair using REECO HOT-AIR systems.

    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    REECO BN9 nozzle for BGA - precision nozzle for BGA assembly and rework

    The REECO BN9 nozzle for BGA is designed for precise work with BGA packages and similar components, such as TQFP packages. Its carefully selected working dimensions ensure uniform heating throughout the package, which is essential during hot-air assembly, removal, and rework operations.

    The BN9 is intended for use with REECO HOT-AIR systems and is suitable for professional electronics repair centers, production facilities, and laboratories.

    Efficient hot air distribution

    The BN9 belongs to the RE-BN (BGA Nozzle) series, developed specifically for BGA applications. Its square profile and open design allow hot air to flow through dedicated channels, enabling the nozzle to sit directly on the PCB surface while delivering even heat distribution across the entire component.

    This design improves process accuracy while minimizing heat exposure to adjacent components.

    Reliable performance for HOT-AIR applications

    The nozzle's optimized construction supports stable and repeatable soldering processes, making it ideal for components that require precise temperature control. The BN9 performs equally well during BGA replacement and other hot air rework applications.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design with dedicated hot air distribution channels
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems
    • Suitable for professional assembly, removal, and rework applications
    • Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 7.65 × 7.65 mm
    External dimensions 12.4 × 12.4 mm

    Precision that improves process quality

    The REECO BN9 nozzle for BGA has been developed for users who require accurate hot air soldering and rework of small BGA packages. Its open construction and optimized heat distribution ensure effective, repeatable operation while providing excellent process control for professional production and electronics repair using REECO HOT-AIR systems.

    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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