REECO BN29 nozzle for BGA - reliable nozzle for precision BGA soldering
The REECO BN29 nozzle for BGA is designed for professional assembly and removal of BGA packages and similar components, including TQFP devices. Its carefully optimized working dimensions ensure accurate hot-air delivery throughout the package, providing uniform heating during soldering and rework operations.
The nozzle is designed for use with REECO HOT-AIR systems and is suitable for electronics repair centers as well as production environments performing professional rework processes.
Design for maximum precision
The RE-BN (BGA Nozzle) series features a square profile specifically engineered for BGA applications. Its open construction distributes hot air through dedicated channels, providing efficient, uniform heating throughout the component.
The nozzle can rest directly on the PCB surface, improving process control while reducing heat loss. This design helps maintain stable soldering conditions and minimizes the risk of overheating adjacent components.
Built for professional rework applications
The REECO BN29 nozzle for BGA is intended for larger electronic packages that require consistent thermal distribution. Its optimized nozzle geometry improves process repeatability and enhances precision during the replacement and repair of electronic assemblies.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design with dedicated hot air flow channels
- Uniform heating across the entire package
- Allows direct contact with the PCB surface
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly and rework processes
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 27.5 × 27.5 mm |
| External dimensions | 32.5 × 32.5 mm |
Precision that improves process quality
The REECO BN29 nozzle for BGA is designed for users who require exceptional accuracy when working with larger electronic packages. Its specialized construction provides uniform hot air distribution across the entire component, supporting safe, repeatable, and efficient assembly and removal processes with professional REECO HOT-AIR systems.
