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REECO BN31 nozzle for BGA

Catalog no.: RE-BN31

REECO BN31 nozzle for BGA
REECO BN31 nozzle for BGA

REECO BN31 nozzle for BGA

Catalog no.: RE-BN31

Net price: 72,00 EUR Gross price: 88,56 EUR

Manufacturer: Reeco

Delivery 14 - 21 days
  • Description
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  • REECO BN31 nozzle for BGA - professional nozzle for BGA rework applications

    The REECO BN31 nozzle for BGA is designed for the precise assembly, removal, and rework of BGA packages and similar components, including TQFP devices. Its optimized dimensions provide an excellent fit for larger packages, ensuring even heat distribution throughout the soldering process.

    The nozzle is intended for use with REECO HOT-AIR systems in electronics service centers, laboratories, and manufacturing environments.

    Optimized hot air flow

    A distinctive feature of the RE-BN (BGA Nozzle) series is its square profile and open design. Hot air is directed through specially engineered channels within the nozzle, allowing uniform heating of the entire package without increasing the process temperature.

    The nozzle can rest directly on the PCB surface, concentrating the hot air precisely where it is needed. This improves the efficiency of assembly and removal processes while minimizing thermal impact on adjacent components.

    Designed for precision and repeatability

    The precision-engineered REECO BN31 nozzle for BGA enables consistent, repeatable rework operations. Its optimized geometry helps maintain stable process conditions during BGA replacement, providing greater process control and improving overall soldering quality.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design for efficient hot air distribution
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems
    • Suitable for professional assembly, removal, and rework applications

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 29 × 29 mm
    External dimensions 34 × 34 mm

    A reliable solution for professional rework

    The REECO BN31 nozzle for BGA is designed for users who require high-precision, repeatable performance when working with larger electronic packages. Its open construction and uniform hot-air distribution make it a practical accessory for professional service and production workstations that use REECO HOT-AIR systems.

    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland
    Description

    REECO BN31 nozzle for BGA - professional nozzle for BGA rework applications

    The REECO BN31 nozzle for BGA is designed for the precise assembly, removal, and rework of BGA packages and similar components, including TQFP devices. Its optimized dimensions provide an excellent fit for larger packages, ensuring even heat distribution throughout the soldering process.

    The nozzle is intended for use with REECO HOT-AIR systems in electronics service centers, laboratories, and manufacturing environments.

    Optimized hot air flow

    A distinctive feature of the RE-BN (BGA Nozzle) series is its square profile and open design. Hot air is directed through specially engineered channels within the nozzle, allowing uniform heating of the entire package without increasing the process temperature.

    The nozzle can rest directly on the PCB surface, concentrating the hot air precisely where it is needed. This improves the efficiency of assembly and removal processes while minimizing thermal impact on adjacent components.

    Designed for precision and repeatability

    The precision-engineered REECO BN31 nozzle for BGA enables consistent, repeatable rework operations. Its optimized geometry helps maintain stable process conditions during BGA replacement, providing greater process control and improving overall soldering quality.

    Key product features

    • Designed for BGA, TQFP, and similar packages
    • Square nozzle profile
    • Open design for efficient hot air distribution
    • Allows direct contact with the PCB surface
    • Uniform heating across the entire component
    • Compatible with REECO HOT-AIR systems
    • Suitable for professional assembly, removal, and rework applications

    Technical specifications

    Parameter Value
    Type RE-BN nozzle (BGA Nozzle)
    Application BGA, TQFP, and similar packages
    Internal dimensions 29 × 29 mm
    External dimensions 34 × 34 mm

    A reliable solution for professional rework

    The REECO BN31 nozzle for BGA is designed for users who require high-precision, repeatable performance when working with larger electronic packages. Its open construction and uniform hot-air distribution make it a practical accessory for professional service and production workstations that use REECO HOT-AIR systems.

    Ask for product
    Responsible
    person
    • Name:
      Dział sprzedaży
    • E-mail:
      sklep@renex.pl
    • Address:
      Al. Kazimierza Wielkiego 6E
    • Postal code:
      87-800
    • City:
      Włocławek
    • Country:
      Poland

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