REECO BN33 nozzle for BGA - precision nozzle for assembly and rework of larger BGA packages
The REECO BN33 nozzle for BGA is designed for hot air soldering applications where uniform heat distribution across the entire component is essential. It is intended for BGA packages and similar components, such as TQFP, providing high precision during assembly, removal, and rework operations.
Its optimized dimensions make the nozzle particularly suitable for working with larger electronic packages used in modern electronic devices.
Engineered for maximum heating efficiency
The RE-BN (BGA Nozzle) series features a square profile specifically developed for BGA applications. Its open design allows hot air to flow through specially engineered channels, ensuring even heat distribution across the entire component.
The nozzle can sit directly on the PCB surface, accurately directing the hot air stream onto the target package while improving heating efficiency and minimizing thermal exposure to surrounding components.
Designed for professional HOT-AIR systems
The REECO BN33 nozzle for BGA is designed for use with REECO HOT-AIR systems in electronics service centers, laboratories, and manufacturing facilities. Its precision construction supports stable, repeatable rework processes, helping to achieve consistent, high-quality solder joints.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design with dedicated hot air channels
- Allows direct contact with the PCB surface
- Uniform heating across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 31.5 × 31.5 mm |
| External dimensions | 36.6 × 36.6 mm |
Reliable support for professional rework
The REECO BN33 nozzle for BGA enables precise assembly and removal of larger electronic packages using hot air technology. Its carefully engineered design provides uniform heat distribution, excellent process repeatability, and reliable performance for professional electronics manufacturing and repair applications.
