REECO BN35 nozzle for BGA - precision nozzle for assembly and rework of larger BGA packages
The REECO BN35 nozzle for BGA is designed for precise assembly and removal of BGA packages and similar components, such as TQFP packages. Its optimized dimensions enable efficient heating of larger electronic packages while ensuring a uniform temperature distribution throughout the hot-air soldering process.
The nozzle is intended for use with REECO HOT-AIR systems in electronics service centers, manufacturing facilities, and laboratories performing advanced assembly and rework operations.
Open design for improved heating efficiency
The RE-BN series features a distinctive square profile and an open construction. Hot air flows through specially engineered channels, allowing it to be distributed evenly across the entire component.
The nozzle can sit directly on the PCB surface, concentrating thermal energy precisely on the target component. This design improves process efficiency while helping reduce heat exposure to adjacent components.
High precision for larger electronic packages
The BN35 nozzle is ideal for professional hot air rework applications requiring precise temperature control and consistent results. Its optimized geometry supports stable soldering conditions, improves process repeatability, and enables safe handling of larger BGA packages.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design for uniform hot air distribution
- Allows direct contact with the PCB surface
- Even heating across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 33.3 × 33.3 mm |
| External dimensions | 38.2 × 38.2 mm |
Reliable accessory for HOT-AIR systems
The REECO BN35 nozzle for BGA has been developed for professional applications where precision and process repeatability are essential. Its open construction and optimized hot air distribution enable efficient assembly and removal of larger BGA packages, making it a practical accessory for modern electronics manufacturing and repair workstations.
