REECO BN37 nozzle for BGA - precision nozzle for rework of large BGA packages
The REECO BN37 nozzle for BGA is designed for working with larger BGA packages and similar components such as TQFP. Its optimized geometry allows the hot air stream to be accurately matched to the component's size, enabling precise assembly, removal, and rework operations.
With its larger working dimensions, the BN37 is particularly well-suited for processing large electronic packages that require uniform heat distribution across the entire component.
Designed for precise heat distribution
The RE-BN series features a distinctive square profile and an open construction. Specially designed air channels distribute hot air evenly around the component, ensuring controlled and consistent heating throughout the soldering process.
The nozzle can sit directly on the PCB surface, concentrating thermal energy exactly where it is needed. This improves process efficiency while minimizing heat exposure to adjacent components.
For production and repair applications
The BN37 is fully compatible with REECO HOT-AIR systems, making it an excellent choice for electronics manufacturing, repair, and laboratory environments. Its precision-machined design helps maintain stable process conditions, supporting repeatable results in both production and professional rework applications.
Key product features
- Designed for BGA, TQFP, and similar packages
- Square nozzle profile
- Open design with dedicated hot air distribution channels
- Allows direct contact with the PCB surface
- Uniform heating across the entire component
- Compatible with REECO HOT-AIR systems
- Suitable for professional assembly, removal, and rework applications
Technical specifications
| Parameter | Value |
|---|---|
| Type | RE-BN nozzle (BGA Nozzle) |
| Application | BGA, TQFP, and similar packages |
| Internal dimensions | 36.5 × 36.5 mm |
| External dimensions | 41.5 × 41.5 mm |
Reliable accessory for professional hot air soldering
The REECO BN37 nozzle for BGA has been developed for users who require high precision when working with large electronic packages. Its open construction and optimized hot air distribution ensure uniform heating, improving process safety, accuracy, and repeatability in professional assembly, repair, and rework applications using REECO HOT-AIR systems.
