3D automatic X - ray inspection system for POP(Package on Package), having the latest semiconductor layering technology
From loading to judgement of NG/Good & sorting out of POP products would be made automatically. And results would be saved into basic data based to help SPC. It has the fastest inspection speed of 2.5sec/FOV
3D In - Line inspection system for POP packages
Good - NG analysis of interconnection using 3D CT
Detection speed: max. 2.5 sec/unit
X - ray tube: 130 kV / 200 µA
Min. resolution: 6~15 µm
Detector: 12 inch (305 mm) FPXD
Chip size: max. 22×22 mm/min. 8×6 mm
Defect types: Non - wet, Open, Short, Big/Small ball
Dimensions: 3080x1730x1920 mm
Name:
Dział sprzedaży
E-mail:
sklep@renex.pl
Address:
Al. Kazimierza Wielkiego 6E
Postal code:
87-800
City:
Włocławek
Country:
Poland
Description
General information
3D automatic X - ray inspection system for POP(Package on Package), having the latest semiconductor layering technology
From loading to judgement of NG/Good & sorting out of POP products would be made automatically. And results would be saved into basic data based to help SPC. It has the fastest inspection speed of 2.5sec/FOV
3D In - Line inspection system for POP packages
Good - NG analysis of interconnection using 3D CT
Detection speed: max. 2.5 sec/unit
X - ray tube: 130 kV / 200 µA
Min. resolution: 6~15 µm
Detector: 12 inch (305 mm) FPXD
Chip size: max. 22×22 mm/min. 8×6 mm
Defect types: Non - wet, Open, Short, Big/Small ball
