Heating with a stream of hot air - uniform temperature distribution over the entire PCB surface
Control the heater with optional software to work with ST - 325 and ST - 350 stations
Hot air stream concentration on PCB board parts - available in 3 nozzles (one as standard)
Equipped with the option of cool air blowing and cooling the plate
ADVANTAGES
Uniform temperature distribution over the entire PCB surface
The process of heating the board placed on the working platform of the device is absolutely safe, there is no bending of the board, and the solder goes into a liquid state allowing for easy disassembly of any components.
By combining the heater with one of the hot air stations offered by RENEX, we obtain an advanced workstation and the ability to perform tasks that were previously impossible or very time - consuming and with a high risk of destroying the elements. We also get the opportunity to work with all available components such as SMD, BGA, PBGA, CSP, Flip Chip.
Name:
Dział sprzedaży
E-mail:
sklep@renex.pl
Address:
Al. Kazimierza Wielkiego 6E
Postal code:
87-800
City:
Włocławek
Country:
Poland
Description
General information
Heating with a stream of hot air - uniform temperature distribution over the entire PCB surface
Control the heater with optional software to work with ST - 325 and ST - 350 stations
Hot air stream concentration on PCB board parts - available in 3 nozzles (one as standard)
Equipped with the option of cool air blowing and cooling the plate
ADVANTAGES
Uniform temperature distribution over the entire PCB surface
The process of heating the board placed on the working platform of the device is absolutely safe, there is no bending of the board, and the solder goes into a liquid state allowing for easy disassembly of any components.
By combining the heater with one of the hot air stations offered by RENEX, we obtain an advanced workstation and the ability to perform tasks that were previously impossible or very time - consuming and with a high risk of destroying the elements. We also get the opportunity to work with all available components such as SMD, BGA, PBGA, CSP, Flip Chip.
