General information

• SMD chip assembly and disassembly kit - especially recommended for repairs: BGA, PBGA, µBGA, CSP, FLIP CHIP
• Thanks to the high - resolution precision optics, accurate positioning of components is easier than ever before
• Mixed heating system (infrared and hot air blowing)
• Maximum PCB size: 305 x 305 mm
• Top heating: induction - convection heater, 300 W
• Lower heating: infrared, 1000 W, 220 x 155 mm
• Vacuum: counterweight balanced by optical sensor and high temperature precision linear ball bearings (contains 7 picks)
• Optical resolution: high resolution (Vision Overlay System)
• Max. component size: 65 mm x 65 mm

ADVANTAGES

• Each component is lifted in an adjustable socket. The lifting is completely safe for the component. The lifting procedure can include the application of flux at the outlets - Fixed optical control system - no calibration required. Real time observation - full image or "in window". Colour camera with 72x magnification and "auto - focus" option. Optics protected against contamination and damage. Independent two - colour lighting for component and board. Very precise Z - axis adjustment.
• Easy profile programming - graphical representation of the process. Infinite number of saved profiles. Heating element with 2000W power, ensuring uniform heat distribution. 4 temperature sensors. Total process control. Automatic adjustment of the pressure force on the component.
• The device is equipped with intuitive software that allows the operator to create profiles very easily and fully control the process. Thanks to the advanced features of the software, assembly and disassembly of components has never been easier or safer. An important advantage is also the ability to keep records and archive the work performed. The software also works with other devices connected to the TF system, e.g.: X - ray.
• The combination of the TF series device with XR - 3000 X - ray is the only complete solution on the market which ensures complete safety of assembly/disassembly. The TF and X - ray system as an integrated workstation with BGA is an offer without a market equivalent.

APPLICATION

• SMT electronics assembly and disassembly - with particular reference to BGA
• Very precise positioning of electronic components
• Processing according to the set profile