General information

• The system is recommended for repairs: BGA, PBGA, µBGA, CSP, FLIP CHIP
• Thanks to the high - resolution precision optics, accurate positioning of components is easier than ever before
• Mixed heating system (infrared and hot air blowing)
• Maximum PCB size: 610 x 610 mm
• Very precise positioning of electronic components
• Top heating: adjustable blowing, convection, air or optional N2 Maximum 20L per minute, 1200W, 100 to 400°C
• Lower heating: infrared, 1x400W, 6x150W, 100 to 221°C
• Max. PCB size: 610 x 610 mm
• Max. Component size: 65 x 65 mm

ADVANTAGES

• Each component is lifted in an adjustable socket. The lifting is completely safe for the component. The lifting procedure can include the application of flux at the outlets
• Real time observation - full image or "in the window". Colour camera with 72x magnification and "auto - focus" option. Optics protected against contamination and damage. Independent two - colour lighting for component and board. Very precise Z - axis adjustment.
• Heating element with 2000W power, ensuring uniform heat distribution. 4 temperature sensors. Total process control. Automatic adjustment of the component pressure.
• The device is equipped with intuitive software that allows the operator to create profiles very easily and fully control the process. Thanks to the advanced features of the software, assembly and disassembly of components has never been easier or safer. An important advantage is also the ability to keep records and archive the work performed. The software also works with other devices connected to the TF system, e.g.: X - ray.